- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/032 - Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
Patent holdings for IPC class H01C 1/032
Total number of patents in this class: 40
10-year publication summary
|
1
|
1
|
6
|
2
|
3
|
5
|
2
|
7
|
5
|
5
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Rohm Co., Ltd. | 5843 |
11 |
| KOA Corporation | 381 |
7 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
6 |
| Shibaura Electronics Co., Ltd. | 97 |
3 |
| Vishay Dale Electronics, LLC | 106 |
3 |
| Siemens Mobility GmbH | 1550 |
2 |
| International Business Machines Corporation | 60644 |
1 |
| Murata Manufacturing Co., Ltd. | 22355 |
1 |
| Epcos AG | 778 |
1 |
| Dongguan Littelfuse Electronics Co., Ltd. | 40 |
1 |
| Kamaya Electric Co., Ltd. | 26 |
1 |
| Viking Tech Corporation | 14 |
1 |
| Eaton Intelligent Power Limited | 6113 |
1 |
| Niterra Co., Ltd. | 1122 |
1 |
| Other owners | 0 |